A TECHNO-ECONOMIC NEWS MAGAZINE FOR MEDICAL PLASTICS AND PHARMACEUTICAL INDUSTRY
Our 12th Year of Publication
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Manufacturing

Ultrasonic Welding, the most widely used welding method, is quite often the joining method of choice for design engineers due to its simplicity of use and rapid joining potential. The process utilizes ultrasonic energy at high frequencies to produce mechanical vibration causing slight melting of the substrate surfaces. There are, however, a number of drawbacks that limit the usefulness of ultrasonic welding. Like solvent welding, ultrasonic welding cannot be used on thermoset plastics and is sensitive to bondline configuration. Large gaps and/or minimal contact areas pose problems for ultrasonic welding processes. In the case where dissimilar plastics are used, similar melting points and chemical compatibility of the two substrates must be considered. Ultrasonic welding requires significant investment for capital equipment as well as special tooling for each unique assembly.

Vibration welding involves the melting of the joint of an assembly via friction caused by the vibration of two substrates in contact with each other. For such a process to work, the materials selected must be thermoplastics, must be somewhat rigid and must have either flat or slightly curved interfaces. As with various other welding processes, capital expenditure as well as special tooling is required. In addition, vibration welding of substrates that contain high levels of moisture may result in bubble formation during processing which, in turn, may result in poor aesthetic appearance and/or weak interfacial bonds.

BENEFITS & LIMITATIONS OF MEDICAL DEVICE ASSEMBLY METHODS

Solvent Welding Ultrasonic Welding Vibration Welding Adhesive Welding
Benefits:
  • Low cost

  • Simple

  • Fast

Benefits:
  • Easily automated

  • Simple

  • Fast

Benefits:
  • Simple

  • Fast

  • Surface preparation not required

Benefits:
  • Join dissimilar materials

  • Even stress distribution

  • Fill large gaps

  • Seal and bond

  • Easily automated

  • Aesthetically acceptable

Limitations:
  • Not usable on thermoset plastics

  • Can cause stress cracking

  • Health & safety issues
    Poor gap filling

Limitations:
  • Not usable on thermoset plastics

  • Plastics must be compatible

  • Poor gap filling

  • Capital cost

  • Must remove or hide weld flash

Limitations:
  • Not usable on thermoset plastics

  • Plastics must be rigid / flat

  • Capital cost

  • Must remove or hide weld flash

Limitations:
  • Requires cure

  • Requires fixture time

Adhesives for the Assembly of Medical Devices

In general, adhesives offer several benefits over other medical device assembly methods including ability to fill large gaps, ability to bond dissimilar materials, ability to distribute stress evenly across a bondline, and ability to form a hermetic seal when confined between two substrates.

The variety of adhesives which currently meet biocompatibility requirements ensure that the majority of device assembly applications can be quickly and effectively completed.

Adhesive Type (Chemistry) Characteristics Typical Applications
Cyanoacrylates
  • Substrate versatility

  • Rapid cure

  • Adhesion to polyolefins with primer

  • Catheter components

  • Tubeset bonding

  • Polyolefin bonding

Light Curing Acrylics
  • Substrate versatility

  • Good resistance properties

  • Cure on demand

  • Needle assembly

  • Anathesia masks

  • Heat exchangers

  • Oxygenators

  • Tubeset bonding

Epoxies
  • Substrate versatility

  • Superior thermal & chemical resistance

  • Low shrinkage

  • High gap filling

  • Needle assembly

  • Deep section potting

Polyurethanes
  • Substrate versatility

  • High peel

  • Good resistance properties

  • Deep section potting

  • Bonding of tips onto various components

Regulatory Issues:

Along with performance issues, medical device manufacturers must also consider regulatory issues. Device manufacturers rely on their component suppliers for assurance that the substrate and/or adhesive will not cause problems with the biocompatibility of the device. In an effort to address such issues, substrate suppliers and adhesive manufacturers began testing their components using testing similar to that used to qualify an end-use device.

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